Discrete Device Photoresist

Description

Discrete Device Photoresists

KMP BP212 series photoresist is a wide-spectrum positive photoresist for discrete devices. It is suitable for wide-spectrum, G-line and I-line exposure. It is a phenolic resin/diazonaphthoquinone system. This series of products has different viscosities. It can cover film thickness from 0.75um to 2.5um, and has the advantages of high resolution, fast photospeed and large process window.

 

KMP BP218 series photoresist is used for discrete devices with positive photoresist. It is suitable for wide spectrum, G line and I line exposure. It is a phenolic resin/diazonium system. This series of products has different viscosity and can be film. Thick from 1.0um to 2.0um, with high resolution, fast speed and large process window.

 

BN301 series UV negative photoresist is a kind of negative photoresist with broad spectrum UV exposure. It is mainly used in the fabrication of semiconductor discrete devices and other micro devices. The viscosity of this product can be adjusted within the range of 20-60mPa.s, covering the thickness range of photoresist film 2.0-3.0um, good adhesion on a variety of substrates, and good resistance to wet etching.

 

BN303 series UV negative photoresist is a kind of negative photoresist with broad spectrum UV exposure. It is mainly used in the production of small and medium scale integrated circuits, discrete devices and other micro devices. The viscosity of this product can be adjusted within the range of 29-100mPa.s, covering the thickness range of photoresist film 0.85-2.1um. The practical resolution is up to 5μm, it has good adhesion on various substrates, and it is resistant to wet etching. Good performance.

 

BN308 series UV negative photoresist is a kind of negative photoresist with broad spectrum UV exposure, mainly used for the fabrication of discrete devices and other micro devices. The viscosity of this product can be adjusted within the range of 140-500mPa.s, covering the thickness range of photoresist film 2.2-6um. The practical resolution is up to 8μm, it has good adhesion on a variety of substrates, wet etching resistance Excellent.

 

BN310 series UV negative photoresist is a kind of negative photoresist with wide-spectrum ultraviolet exposure. It is mainly used in the production of small and medium-sized integrated circuits, discrete devices and other micro devices. The viscosity of this product can be adjusted within the range of 27-39mPa.s, covering the thickness range of photoresist film 0.85-1um. The practical resolution is up to 2μm, and it has good adhesion on various substrates, including anti-halation dye. Can be used on highly reflective substrates.

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