Lead-Free Solder Ball


Lead-Free Solder Ball

  • Product Feature

☆ Manufactured from alloy and BGA Solder Ball, and R & D per customer needs.
☆ self-developed patent production equipment, can produce 0.035mm~0.889mm high quality BGA solder ball, suitable for semiconductor and related industries for packaging.
☆ Packaging material using anti-static material, static electricity can be attached to avoid the bottle, resulting in the use of distress.
☆ original patents were obtained, can be safe to use, no infringement concerns.


  • Application

IC Packaging Materials


  • Catalog and Specification

Product Specification/ Packing Method



Low Alpha Solder: we can provide various of low alpha level product. Alpha particles <0.01 cph/cm2 , <0.002 cph/cm2, <0.001 cph/cm2
Patent No:
 ISURF-U.S 5,527,628 not include Japan
 AIM-U.S5,352407 U.S5,405,577 JP2,752,258
 FUJI-U.S6,179,935 JP3,296,289

<1>If need product information or other materials, sizes & spec., please call me we will provide the relevant document or information.
<2>Some Alloys / Diameters are subjected to MOQ or special production cost.



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