KMP E3100 series photoresist is a UV negative photoresist developed for the Lift Off process. It uses a phenolic resin system and is compatible with the positive glue process (developed with a positive gel developer). The E3100 series has multiple models with a film thickness range of 1.0-4.5um, which can meet the needs of different processes for the reverse ladder angle. In addition, it has the advantages of high resolution, large process window and easy glue removal. It is widely used in IC/LED chips. Lift Off process in the manufacturing process.
KMP E3200 series of photoresists are UV negative photoresists developed for the Lift Off process. They are thicker than the E3100 and cover a range of 6.0-12.0um. The utility model has the advantages of adjustable stepping angle, high resolution, large process window and easy glue removal, and is widely used in the Lift Off process in the LED chip manufacturing process, especially the LED high power device and the flip chip manufacturing process.
KMP EP3100 series photoresist is a G/I line positive photoresist, which is characterized by fast photospeed and high resolution. It is mainly used in the field of LED chip manufacturing, which can effectively improve the yield of chip manufacturing enterprises.
KMP EP3200 series photoresist is a G/I line positive photoresist, mainly used in LED chip manufacturing, with moderate speed, high resolution, large process window, and excellent adhesion. In the case of using HMDS, it is possible to maintain no development when developing and no etching during wet etching.