Tin-Lead Solder Sphere
Solder Sphere (Tin Lead)
- Product Feature
☆ Manufactured from alloy and BGA Solder Ball, and R & D per customer needs.
☆ self-developed patent production equipment, can produce 0.06mm~0.76mm high quality BGA solder ball, suitable for semiconductor and related industries for packaging.
☆ Packaging material using anti-static material, static electricity can be attached to avoid the bottle, resulting in the use of distress.
IC Packaging Materials
- Catalog and Specification
Product Specification/ Packing Method
<1>If need product information or other materials and sizes, please call me we will provide the relevant document or information.
<2>Some Alloys / Diameters are subjected to MOQ or special production cost.